• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    [Object] To improve the shape accuracy of electroformed portions at a boundary of layers in a method of manufacturing a multilayer electroformed product. [Solvent] A method of manufacturing an electroformed product 100, wherein electroformed portions 40, 80 formed by metal plating are stacked in the thickness direction, thereby integrally forming the two-layer electroformed portions 40, 80, comprising the steps of: forming a metal plating 50 having good corrosion resistance on a surface 41 of the previously formed electroformed portion 40 of the first layer on which the electroformed portion 80 of the second layer is laminated; Forming a resist 60 for the electroformed portion 80 on the metal coating 50; Removing a portion 62 of the resist 60 corresponding to the electroformed portion 80 by exposure and development; and forming the electroformed portion 80 on an unexposed area 62 from which the resist 60 has been removed.
    公开号:CH717177A2
    申请号:CH00172/21
    申请日:2021-02-22
    公开日:2021-08-31
    发明作者:Sasaki Yousuke
    申请人:Citizen Watch Co Ltd；
    IPC主号:
    专利说明:

    [Technical area]
    The present invention relates to a method for manufacturing an electroformed product and to an electroformed product.
    [Technical background]
    Tiny structures, such as. B. watch parts and others are made by electroforming. Objects are also proposed as electroformed products which consist of multilayer (multi-stage) electroformed parts which, depending on their position, have different contour shapes in the direction of thickness (see, for example, JP 6284144B and EP 2405301A1).
    According to the technique described in JP 6284144B, a barrier layer is formed on the surface (ie, the surface that is in contact with an electroformed portion of the second layer (second stage)) of an electroformed portion (ie, portion that is in the process of electroforming ( Plating) of the first layer (first stage) is provided, after which a resist of the second layer is formed on the entire surfaces of the barrier layer and a resist of the first layer. After exposure and development of the second layer resist, the barrier layer on the surface of the electroformed portion of the first layer is removed to form an electroformed portion of the second layer which is in contact with the surface of the electroformed portion of the first layer.
    According to the technique described in EP 2405301A1, a resist of the second layer is formed on the entire surface of an electroformed portion of the first layer (i.e., portion formed in the electroforming (plating) process). After exposure and development of the resist of the second layer, an electroformed portion of the second layer is formed which is in contact with the surface of the electroformed portion of the first layer.
    [Summary of the invention]
    [Problem to be solved by the invention]
    In the technique described in JP 6284144B, when removing the barrier layer formed on the surface of the electroformed portion of the first layer, not only the barrier layer in an area in contact with the electroformed portion of the second layer, but also removes the barrier layer in an area that is in contact with the resist of the second layer.
    As a result, an air gap corresponding to the removed barrier layer is formed between the electroformed portion of the first layer and the resist of the second layer. As a result, the electroformed section of the second layer is also formed in this air gap. The electroformed section of the second layer, the contour of which should actually be defined by the resist of the second layer, is thus also formed in the air gap that lies outside the resist of the second layer. This creates a problem that the dimensional accuracy of the shape of the electroformed portion deteriorates.
    In the technique described in EP 2405301A1, an oxide layer is formed on the surface of the formed electroformed portion of the first layer by a reaction between the electroformed portion and the oxygen in the air. The oxide layer reduces the degree of connection between the electroformed portion of the second layer and the electroformed portion of the first layer. Therefore, it is necessary to remove the oxide layer formed on the surface of the electroformed portion of the first layer after exposing and developing the resist of the second layer by a strong acid or the like. to remove.
    However, when removing the oxide layer formed on the surface of the electroformed portion of the first layer, the oxide layer is not only in an area that is in contact with the electroformed portion of the second layer, but also in an area that is in contact with the resist of the second layer.
    Accordingly, as in JP 6284144B, an air gap, which corresponds to the removed oxide layer, is formed between the electroformed portion of the first layer and the resist of the second layer. As a result, the electroformed section of the second layer is also formed in this air gap. The electroformed section of the second layer, the contour of which should actually be defined by the resist of the second layer, is thus also formed in the air gap that lies outside the resist of the second layer. This creates a problem that the dimensional accuracy of the shape of the electroformed portion deteriorates.
    In view of the above, it is an object of the present invention to provide a method of manufacturing an electroformed product and an electroformed product in which corrosion of an electroformed portion at a layer boundary is prevented, shape accuracy is improved, while sufficient adhesion between layers is achieved can.
    [Means of solving the task]
    The present invention is, on the one hand, a method for producing an electroformed product, wherein electroformed portions formed by metal plating are stacked in the thickness direction, whereby the multilayer electroformed portions are integrally formed, comprising the following steps: Forming a metal coating, which has good corrosion resistance and is difficult to form an oxide film, on a surface of the previously formed electroformed portion on which the next electroformed portion is coated; Forming a resist for the next electroformed portion on the metal coating; Removing a portion of the resist corresponding to the next electroformed portion by exposure and development; and forming the next electroformed portion where the resist was removed.
    The present invention is, on the other hand, an electroformed product in which a plurality of electroformed portions formed by metal plating are stacked in the thickness direction with a metal plating having no oxide film and good corrosion resistance at a boundary between the electroformed ones being stacked Sections is formed at which a step is generated.
    [Advantages of the invention]
    According to the method for manufacturing an electroformed product and the electroformed product of the present invention, corrosion of the electroformed portion at the layer boundary can be prevented, shape accuracy can be improved, and at the same time, sufficient adhesion between layers can be obtained.
    [Brief Description of the Drawings]
    Fig. 1A is a schematic sectional view (1) showing the flow of the method for manufacturing a two-layer electroformed product according to an embodiment of the present invention. 1B is a schematic sectional view (2) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1C is a schematic sectional view (3) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1D is a schematic sectional view (4) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1E is a schematic sectional view (5) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1F is a schematic sectional view (6) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1G is a schematic sectional view (7) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1H is a schematic sectional view (8) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. FIG. 1I is a schematic sectional view (9) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. FIG. 1J is a schematic sectional view (10) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1K is a schematic sectional view (11) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1L is a schematic sectional view (12) showing the flow of the method for manufacturing the two-layer electroformed product according to the embodiment. 1M is a schematic sectional view (1) of an electroformed product during the manufacturing process according to an alternative example 1, wherein an electroformed product is manufactured in which an electroformed portion of the second layer is larger than an electroformed portion of the first layer, corresponding to the one in FIG Process shown in Fig. 1E. 1N is a schematic sectional view (2) of the electroformed product during the manufacturing process according to Alternative Example 1, corresponding to the process shown in FIG. 1H. 10 is a schematic sectional view (3) of the electroformed product during the manufacturing process according to the alternative example 1, corresponding to the process shown in FIG. 1L. 1P is a schematic cross-sectional view of an electroformed product in the process of forming a resist of the first layer on a screen-forming layer in the method of manufacturing an electroformed product according to Alternative Example 2, in which a metal coating is formed on the side surfaces of an electroformed portion of the first layer corresponding to the process shown in Fig. 1A. 1Q is a schematic cross-sectional view of the electroformed product in the process of removing the resist of the first layer after forming the electroformed portion of the first layer in the manufacturing method according to Alternative Example 2. FIG. 1R is a schematic cross-sectional view of the electroformed product in the process of removing of a part of the screen-forming layer in the manufacturing process according to Alternative Example 2. FIG Alternative Example 2. Fig. 1T is a schematic sectional view of the electroformed product in the process of forming a resist of the second layer in the manufacturing method according to Alternative Example 2. Fig. 1U is a diagram A schematic sectional view of the electroformed product in the process of forming an electroformed portion of the second layer and removing the resist in the manufacturing process according to the alternative example 2. Fig. 1V is a schematic sectional view of the electroformed product in the process of forming an electroformed product in the manufacturing process according to the alternative Example 2, wherein the electroformed portion of the first layer and the electroformed portion of the second layer are integrally formed, and the metal coating is also formed on the side surfaces of the electroformed portion of the first layer. 1W is a schematic cross-sectional view of the electroformed product in the process of removing the metal coating by etching except for a portion immediately below the electroformed portion of the first layer. 2A is a schematic sectional view (1) showing the flow of the method for manufacturing a two-layer electroformed product according to an alternative example 3. FIG. 2B is a schematic sectional view (2) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 3. FIG. 2C is a schematic sectional view (3) showing the flow of the method for producing the two-layer electroformed product according to Alternative Example 3. 2D is a schematic sectional view (4) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 3. FIG. 2E is a schematic sectional view (5) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 3. FIG. 2F is a schematic sectional view (6) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 3. 2G is a schematic sectional view (7) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 3. FIG. 2H is a schematic sectional view (8) showing the flow of the method for producing the two-layer electroformed product according to Alternative Example 3. 3A is a schematic sectional view (1) showing the flow of the method for producing a two-layer electroformed product according to an alternative example 4. 3B is a schematic sectional view (2) showing the flow of the method for producing the two-layer electroformed product according to Alternative Example 4. 3C is a schematic sectional view (3) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 4. FIG. 3D is a schematic sectional view (4) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 4. FIG. 3E is a schematic sectional view (5) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 4. 3F is a schematic sectional view (6) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 4. 3G is a schematic sectional view (7) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 4. 3H is a schematic sectional view (8) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 4. 4A is a schematic sectional view (1) showing the flow of the method for manufacturing a two-layer electroformed product according to Alternative Example 5. 4B is a schematic sectional view (2) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 5. 4C is a schematic sectional view (3) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 5. 4D is a schematic sectional view (4) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 5. 4E is a schematic sectional view (5) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 5. 4F is a schematic sectional view (6) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 5. 4G is a schematic sectional view (7) showing the flow of the method for manufacturing the two-layer electroformed product according to Alternative Example 5.
    [Embodiment of the invention]
    In the following, an embodiment of the method for manufacturing an electroformed product and the electroformed product according to the present invention will be described with reference to the drawings.
    1A-1L are schematic sectional views showing the flow of the method for manufacturing an electroformed product 100 according to the embodiment of the present invention. In the illustrated method of manufacturing the electroformed product 100, two-layer electroformed portions 40, 80 are integrally formed by stacking the electroformed portions 40, 80 formed by metal plating in the thickness direction.
    In this production method, as shown in FIG. 1A, a resist 20 of the first layer is first applied to an electrically conductive substrate 10.
    The electrically conductive substrate 10 can consist of an electrically conductive metal or be formed such that a substrate body made of a semiconductor, such as. B. silicon, or a substrate body made of a non-conductive synthetic resin or the like. is provided with an electrically conductive layer in order to develop an electrical conductivity. The electrically conductive substrate 10 can also be formed by stacking a plurality of different metals.
    The resist 20 is z. B. formed from a chemically reinforced negative photoresist based on epoxy, but is not limited to the negative resist, but can, for. B. be a positive photoresist based on polymethyl methacrylate.
    Subsequently, in the manufacturing method according to the present embodiment, as shown in Fig. 1B, the resist 20 is irradiated (exposed) with UV light (ultraviolet light) L through a photomask 30 provided with openings 31 and a shield 32. As a result, areas (exposed areas) 21 which were irradiated with the UV light L through the openings 31 and an area (unexposed area) 22 which was not irradiated with the UV light L due to the shield 32 are formed on the resist 20.
    Next, as shown in Fig. 1C, the unexposed area 22 of the resist 20 is removed by developing. A corresponding cavity 23 is formed at the point where the unexposed area 22 was present.
    Next, as shown in Fig. 1D, electroplating (Ni) is performed using the substrate 10 as a cathode, thereby forming an electroformed portion 40 of the first layer (previously formed electroformed portion) of nickel with which the cavity 23 is filled with the exposed areas 21 and substrate 10 serving as a mold.
    The electroforming material is not limited to nickel, but any electroformable material such as copper (Cu), tin (Sn) or cobalt (Co) can be used. Here, as needed, a surface 41 of the electroformed portion 40 of the first layer and a surface of the resist 20 of the first layer (exposed areas 21) are ground and polished to make them flat.
    Next, an oxide layer is formed on the surface 41 of the first electroformed portion 40 of the first layer (ie, surface (upper surface in Fig. 1E) on which a next electroformed portion (electroformed portion 80 of the second layer) is stacked) , to form a metal coating 50 which is a layer of a noble metal (e.g., a metal selected from a group consisting of gold (Au), silver (Ag), and platinum group elements ) or an alloy of precious metals (it is sufficient if it is an alloy that is difficult to form an oxide layer, such as in the case of gold, a gold-silver alloy, which is an alloy of Gold and silver, or a gold-platinum alloy which is an alloy of gold and platinum, etc.).
    The metal coating 50 can be provided on the lower layer side with a layer of titanium (Ti) or chromium (Cr), but must have a noble metal or an alloy of noble metals on the upper layer side (exposed side).
    The metal coating 50 may be formed not only on the surface 41 of the electroformed portion 40 but also on the surface of the exposed areas 21 of the resist 20. However, the metal coating 50 on the surface of the exposed areas 21 is ultimately removed and is therefore not necessary for the electroformed product 100.
    The metal coating 50 formed only on the surface 41 of the electroformed portion 40 may be formed by wet plating, or by dry plating such as sputtering, vapor deposition, ion plating or the like, using a stencil mask with one of the surface 41des Electroformed portion 40 corresponding opening is applied tightly to the surface. The metal coating 50 may also be formed on the entire surface including the surface 41 of the electroformed portion 40 by any of the above methods after the exposed areas 21 of the resist 20 of the first layer have been removed.
    After the metal coating 50 is formed on the surface 41 of the electroformed portion 40, as shown in Fig. 1F, a resist 60 of the second layer (resist for the next electroformed portion) is formed on the electroformed portion 40 of the first layer and the exposed areas 21 of the resist 20 .
    Next, as shown in Fig. 1G, the UV light L is irradiated (exposed) on the resist 60 through a photo mask 70 provided with openings 71 and a shield 72. As a result, areas (exposed areas) 61 which were irradiated with the UV light L through the openings 71 and an area (unexposed area) 62 which was not irradiated with the UV light L due to the shield 72 are formed on the resist 60 of the second layer . The unexposed area 62 is formed to overlay at least a portion of the electroformed portion 40 of the first layer.
    Next, as shown in Fig. 1H, the unexposed area 62 of the resist 60 is developed away to form a cavity 63 (location corresponding to the next electroformed portion) corresponding to the unexposed area 62. A portion of the exposed areas 61 of the resist 60 that was not removed remain on the metal coating 50.
    Here, the surface 41 of the electroformed portion 40 of the first layer is covered by the metal coating 50. Also in the area facing the cavity 63, it is not the electroformed section 40, but rather the metal coating 50 covering the electroformed section 40 in the cavity 63 that is exposed.
    In an article different from the present embodiment such that the surface of the electroformed portion 40 is not covered by the metal coating 50, the surface of the electroformed portion 40 is exposed to the air at a stage before the resist 60 is formed. As a result, the surface of the electroformed portion 40 is oxidized and an oxide layer is formed. This oxide layer is also created by the development to remove the unexposed area 62 or. by exposing in cavity 63.
    The oxide layer must be removed because it deteriorates the adhesiveness between the electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer formed thereon. To remove the oxide layer, z. B. a strong acid such as hydrochloric acid is used. When removing the oxide layer in the area facing the cavity 63 with the strong acid, the strong acid seeps into a boundary 65 between the surface 41 of the electroformed portion 40 and the remaining resist 60 of the second layer (exposed areas 61), and also removes that on the Boundary 65 formed oxide layer.
    When the oxide layer is removed at the boundary 65, a gap arises at the boundary 65 and a deviation in the contour shape of the later-described electroformed portion 80 of the second layer arises. Further, since the boundary 65 is narrow, a corrosive solution for removing an oxide film or a plating solution can easily be left and the surface of the electroformed portion 40 can be corroded.
    In contrast, in the manufacturing method according to the present embodiment, the surface 41 of the electroformed portion 40 of the first layer is covered by the metal coating 50 as shown in Fig. 1H. The metal coating 50 is made of elements that are difficult to oxidize, so that oxidation almost never occurs. It therefore has better affinity and adhesiveness with the electroformed portion 80 of the second layer than does the oxide layer. In the manufacturing method according to the present embodiment, since the metal coating 50 is already present at the stage in which the cavity 63 shown in Fig. 1H is formed, it is not necessary to carry out the process of removing the oxide layer with the strong acid.
    If there is a residue of the resist 60 on the surface of the metal coating 50 after development, the residue can be removed by plasma ashing or the like. This plasma ashing does not result in a gap at the boundary 65.
    Next, as shown in Fig. 1I, by electroplating using the substrate 10 as a cathode, the electroformed portion 80 of the second layer of nickel is formed, with which the cavity 63 is filled, with the exposed areas 61 and the electroformed portion 40 of the serve as a mold for the first layer.
    The electroforming material is not limited to nickel, but any electroformable material such as copper, tin or cobalt can be used. Here, as needed, the surface of the electroformed portion 80 of the second layer and the surface of the resist 60 of the second layer (exposed areas 61) are ground and polished to make them flat.
    Subsequently, as shown in Fig. 1J, the resist 20 of the first layer (exposed areas 21) and the resist 60 of the second layer (exposed areas 61) are removed to form the electroformed product 100 in which the electroformed portion 40 of the first Layer and the electroformed portion 80 of the second layer, which is different in shape from the first layer, are integrally formed.
    Next, as shown in Fig. 1K, the metal coating 50 formed on the boundary 65 of the electroformed product 100 is removed by etching as necessary (the metal coating 50 can be separated from the removed metal coating 51 and the unremoved metal coating as necessary Must be distinguished). If the metal coating is 50z. B. gold, an iodine-based etching solution can be used.
    By finally separating the electroformed product 100 from the substrate 10, an electroformed product 100 can be completed in which, as shown in Fig. 1L, the shapes of the two layers are integrally formed.
    Thus, in the method for producing an electroformed product 100 according to the present embodiment, there is no oxide layer on the surface of the electroformed portion 40 of the first layer, so that there is none at the boundary 65 between the surface of the electroformed portion 40 of the first layer and the resist 60 of the second layer Gap arises.
    This makes it possible to prevent contour shape defects, shape defects and corrosion of the electroformed portion 80 of the second layer, which are caused by the formation of the gap at the boundary 65, so that the dimensional accuracy of the manufactured electroformed product 100 can be improved.
    In addition, it is not necessary to remove the oxide layer, for. B. to be removed by a corrosive liquid (strong acid or the like) before electroplating the second layer.
    In the electroformed product 100 manufactured by the manufacturing method according to the present embodiment, the metal coating 50 is formed at a boundary between the electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer at which a step is created. However, the metal coating 50 has good adhesiveness between the electroformed portions 40 and 80, so that the strength of integrally forming the electroformed portion 40 and the electroformed portion 80 can be ensured.
    In addition, since the electroformed product 100 according to the present embodiment does not have an oxide layer at the boundary between the electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer, discoloration and deterioration in strength caused by the corrosion caused by the can be prevented Residue of the corrosive solution used for removing an oxide film or the plating solution is caused.
    <Alternative example 1>
    In the method for manufacturing an electroformed product 100 and the electroformed product 100 according to the embodiment described above, the later-formed electroformed portion 80 of the second layer is smaller than the earlier-formed electroformed portion 40 of the first layer. As shown in Fig. 1E, the electroformed portion 80 of the second layer is formed in a size corresponding to a portion of the area of the metal coating 50 that is not on the surfaces of the exposed areas 21 of the resist 20 of the first layer but only on the surface of the electroformed portion 40 of the first layer is formed.
    In the method for manufacturing an electroformed product and the electroformed product according to the present invention, however, the electroformed portion of the second layer need not necessarily be smaller than the electroformed portion of the first layer. The electroformed portion of the second layer can also be larger than the electroformed portion of the first layer or the same size as the electroformed portion of the first layer.
    For example, an alternate example 1 of the method of making an electroformed product 100 is specifically described in which the electroformed portion 80 of the second layer is larger than the electroformed portion 40 of the first layer.
    Fig. 1M is a schematic sectional view (1) of an electroformed product during the manufacturing process according to Alternative Example 1, wherein an electroformed product is manufactured in which the electroformed portion 80 of the second layer is larger than the electroformed portion 40 of the first layer, according to the process shown in Fig. 1E.
    In the process shown in Fig. 1E, it is sufficient if the metal coating 50 is formed only on the surface 41 of the electroformed portion 40. On the other hand, in the process shown in Fig. 1M, the metal coating 50 is formed not only on the surface 41 of the electroformed portion 40 of the first layer but also on the surfaces of the exposed areas 21 of the resist 20 adjacent to the electroformed portion 40.
    Also, although the electroformed portion 80 of the second layer is larger than the electroformed portion 40 of the first layer, the metal coating 50 may be formed only on the surface 41 of the electroformed portion 40. It does not necessarily have to be formed on the surfaces of the exposed areas 21 of the adjacent resist 20.
    It is advantageous, however, to also form the metal coating 50 on the surfaces of the exposed areas 21 of the adjacent resist 20, since the formation of the metal coating 50 also on the surfaces of the exposed areas 21 of the adjacent resist 20 can promote the growth of the electroformed portion 80 of the second layer in areas which protrude in the width direction from the electroformed portion 40 of the first layer.
    The metal coating 50 can also be formed according to the shape of the electroformed portion 80 of the second layer. In this case, the metal coating 50 may be formed according to the shape of the electroformed portion 80 of the second layer by etching with a stencil mask or photolithography.
    After the metal coating 50 is formed on the surface 41 of the electroformed portion 40 of the first layer and on the surfaces of the exposed areas 21 of the resist 20 (Fig. 1M), the resist 60 of the second layer is formed on the metal coating 50 as in Fig. 1F, and Figs the resist 60 is irradiated (exposed) with the UV light L through the same photomask 70 as that in Fig. 1G.
    The shield 72 of the photomask 70 is formed in a size corresponding to the electroformed portion 80 of the second layer, i.e., in a size larger than the electroformed portion 40 of the first layer.
    Fig. 1N is a schematic sectional view (2) of the electroformed product during the manufacturing process according to Alternative Example 1, corresponding to the process shown in Fig. 1H according to the above embodiment.
    The unexposed area 62 of the resist 60 of the second layer, which is shielded from light by the photomask 70, is removed by the subsequent development as shown in Fig. 1N (drawing corresponding to Fig. 1H). On the entire bottom surface of the cavity 63 formed by removing the unexposed area 62, the metal coating 50 remains and is exposed.
    Next, as with the process in Fig. 1I, electroplating is done using the substrate 10 as the cathode, thereby forming the electroformed portion 80 of the second layer of nickel which fills the cavity 63. As a result, the electroformed portion 80 of the second layer that is larger than the electroformed portion 40 of the first layer is formed.
    Thereafter, as with the process in Figure 1J, the remaining portion of the second layer resist 60 and the remaining portion of the first layer resist 20 outside of the electroformed portion 80 of the second layer and the electroformed portion 40 of the first layer are removed.
    Here, unlike the above embodiment, since the metal coating 50 is formed on the surface of the resist 20 of the first layer, the resist 60 of the second layer covering the first layer is removed. However, since the resist 20 of the first layer is covered by the metal coating 50, the resist 20 of the first layer may not be removed at the same time in the process of removing the resist 60 of the second layer.
    If, in the process of removing the resist 60 of the second layer, the resist 20 of the first layer could not be removed at the same time, after the removal of the resist 60 of the second layer, the areas of the surface of the resist 20 of the first layer from the electroformed portion 40 of the first layer Layer-covering metal coating 50 can be removed by etching and, after removing this metal coating 50, the resist 20 of the first layer can be removed.
    Fig. 10 is a schematic sectional view (3) of the electroformed product during the manufacturing process according to Alternative Example 1, corresponding to the process shown in Fig. 1L according to the above embodiment.
    By finally separating the electroformed product 100 from the substrate 10, an electroformed product 100 can be completed in which, as shown in FIG the first layer and is larger than the first layer, are formed in one piece.
    Alternatively, a portion of the metal coating 50 on the bottom surface of the electroformed portion 80 of the second layer that protrudes from an area between the electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer may be etched away as needed.
    Thus, even in the method of making an electroformed product 100 in which the electroformed portion 80 of the second layer is made larger than the electroformed portion 40 of the first layer, there is no gap at the boundary 65 (see FIG. 1N) between the surface of the electroformed portion 40 of the first layer and the resist 60 of the second layer, so that the dimensional accuracy of the manufactured electroformed product 100 can be improved.
    Thereby, the same effects and effects can be obtained as in the method of manufacturing an electroformed product 100 in which the electroformed portion 80 of the second layer is made smaller than the electroformed portion 40 of the first layer.
    <Alternative example 2>
    In the method for manufacturing an electroformed product 100 and the electroformed product 100 according to the embodiment described above, no metal coating 50 is applied to the side surfaces of the electroformed product 100 (areas along the stacking direction in which the electroformed portion 40 of the first layer and the electroformed portion 80 of the second Layer are stacked) formed.
    However, since a surface on which the metal coating 50 is formed can have higher wear resistance, corrosion resistance and decorative effect, it is advantageous to form the metal coating 50 on the side surfaces of the electroformed product 100 when the manufactured electroformed product 100 is applied to components (e.g. B. gears, clock dials or clock indices) is used for which it is necessary to improve the wear resistance, corrosion resistance and the decorative effect of the side surfaces.
    Thus, for example, the method for manufacturing an electroformed product 100 according to an alternative example 2 will be described, wherein the metal coating 50 is formed on the side surfaces of the electroformed portion 40 of the first layer, showing differences from the embodiment described above.
    Fig. 1P is a schematic sectional view of an electroformed product in the process of forming the resist 20 of the first layer on a screen-forming layer 11 in the method of making an electroformed product 100 according to Alternative Example 2, in which the metal coating 50 is on the side surfaces 40a of the electroformed portion 40 of the first layer is formed according to the process shown in Figure 1A.
    In the process shown in Fig. 1A, it is sufficient if the resist 20 of the first layer is coated directly on the substrate 10. In contrast, in the process shown in Fig. 1P, before forming the resist 20 of the first layer on the substrate 10, a screen-forming layer 11 is formed on the substrate 10, and the resist 20 of the first layer is formed on the screen-forming layer 11.
    The screen-forming layer 11 is a layer that forms a gap between the substrate 10 and the electroformed portion 40 of the first layer so that edges, described later, of the bottom of the electroformed portion 40 of the first layer overhang the substrate 10 in the form of a screen. The screen-forming layer 11 is made of an electrically conductive material different from the metal that forms the metal coating 50.
    Fig. 1Q is a schematic cross-sectional view of the electroformed product 100 in the process of removing the resist 20 of the first layer after forming the electroformed portion 40 of the first layer in the manufacturing method according to the alternative example 2. As shown in Fig. 1P, the resist 20 is the The first layer is formed on the screen-forming layer 11, and thereafter the electroformed portion 40 of the first layer is formed in the same manner as in the processes of Figs. 1B-1D. Thereafter, the resist 20 of the first layer is removed as shown in Fig. 1Q, and further, a part of the screen-forming layer 11 on the substrate 10 is removed by etching.
    Fig. 1R is a schematic sectional view of the electroformed product 100 in the process of removing a part of the screen-forming layer 11 in the manufacturing method according to Alternative Example 2. When removing the screen-forming layer 11 by etching, only parts of the screen-forming layer 11 facing the resist 20 are usually through Etching removed. However, in alternative example 2, as shown in Figure 1R, a portion of the screen-forming layer 11 between the electroformed portion 40 of the first layer and the substrate 10 is also removed by e.g. B. the etching time is extended.
    Specifically, a part of the screen-forming layer 11 between the electroformed portion 40 of the first layer and the substrate 10 is removed so that side surfaces 11a of the screen-forming layer 11 between the electroformed portion 40 of the first layer and the substrate 10 are at a position where the side surfaces 11a of the screen-forming layer 11 are retracted from the side surfaces 40a of the electroformed portion 40 toward the inside.
    This forms gaps 12 below the edges of the electroformed portion 40 adjacent to the side surfaces 40a of the electroformed portion 40 of the first layer between the electroformed portion 40 of the first layer and the substrate 10, where the screen-forming layer 11 has been removed. In the gaps 12, the edges of the electroformed section 40 next to the side surfaces 40a of the electroformed section 40 are formed in the form of a screen with respect to the substrate 10.
    Fig. 1S is a schematic cross-sectional view of the electroformed product 100 in the process of forming the metal coating 50 on the surface 41 and side surfaces 40a of the electroformed portion 40 of the first layer and the top surface of the substrate 10 in the manufacturing process according to Alternative Example 2. In FIG. In the state shown in Fig. 1R, the metal coating 50 is formed by sputtering or vapor deposition as in Fig. 1E. Thereby, as shown in Fig. 1S, the metal coating 50 is formed on the surface 41 and the side surfaces 40a corresponding to the top surface of the electroformed portion 40 of the first layer as well as on the top surface of the substrate 10.
    Since the gaps 12 are formed below the edges of the electroformed portion 40 adjacent to the side surfaces 40a of the electroformed portion 40 of the first layer, the metal coating 50 formed on the side surfaces 40a of the electroformed portion 40 and the metal coating 50 formed on the upper surface of the substrate 10 are not bonded together, but there are interruptions between them.
    Fig. 1T is a schematic sectional view of the electroformed product 100 in the process of forming the resist 60 of the second layer in the manufacturing method according to Alternative Example 2. As shown in Fig. 1T, the resist 60 of the second layer is formed to a height at the electroformed portion 40 of the first layer is completely covered and the electroformed portion 80 of the second layer can be formed on the electroformed portion 40 of the first layer.
    Fig. 1U is a schematic cross-sectional view of the electroformed product 100 in the process of forming the electroformed portion 80 of the second layer and removing the resist 60 in the manufacturing method according to Alternative Example 2. Fig. 1V is a schematic cross-sectional view of the electroformed product 100 in the process of forming of the electroformed product 100 in the manufacturing method according to Alternative Example 2, wherein the electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer are integrally formed, and the metal coating 50 is also formed on the side surfaces 40a of the electroformed portion 40 of the first layer.
    As with the processes in Figures 1G-1I, the electroformed portion 80 of the second layer is formed over the metal coating 50 on the electroformed portion 40 of the first layer. As in Fig. 1J, the resist 60 is removed as shown in Fig. 1U, and finally the screen-forming layer 11 is removed by etching. This can produce an electroformed product 100 in which, as shown in Fig. 1V, the metal coating 50 is formed on the side surfaces 40a of the electroformed portion 40 of the first layer.
    Since the metal coating 50 on the side surfaces 40a of the electroformed portion 40 of the first layer and the metal coating 50 on the substrate 10 are separated as shown in Fig. 1U, the etching solution used to remove the screen-forming layer 11 can pass through it Gap between the electroformed portion 40 of the first layer and the substrate 10.
    As a result, in the article shown in Fig. 1U, the screen-forming layer 11 formed between the electroformed portion 40 of the first layer and the substrate 10 can be easily removed by the etching solution, as compared with an article in which there is no break (the electroformed Portion 40 of the first layer directly on the substrate 10 without the screen-forming layer 11 being formed).
    In the article shown in Fig. 1Q, the electroformed portion 40 is formed in contact with the screen-forming layer 11. However, it is also possible to form the metal coating 50 on the upper surface of the screen-forming layer 11 and then to form the electroformed portion 40 on the metal coating 50.
    Figure 1W is a schematic cross-sectional view of the electroformed product 100 in the process of removing the metal coating 50 by etching except for a portion immediately below the electroformed portion 40 of the first layer. As shown in Fig. 1R, prior to removing part of the screen-forming layer 11 between the electroformed portion 40 of the first layer and the substrate 10 to form the gaps 12 as shown in Fig. 1W, the metal coating 50 formed on the screen-forming layer 11 is etched with Except for a portion immediately below the electroformed portion 40 of the first layer.
    In this case, the metal coating 50 immediately below the electroformed portion 40, unlike the previously described screen-forming layer 11, does not have to be removed to a position where the metal coating 50 is withdrawn from the side surfaces 40a of the electroformed portion 40 to the inside, but rather it is sufficient if thereafter the screen-forming layer 11 between the (remaining metal coating 50 immediately under the) electroformed portion 40 of the first layer and the substrate 10, as in Fig. 1R, is removed to a position where the screen-forming layer 11 is removed from the side surfaces 40a of the electroformed portion 40 is withdrawn towards the inside.
    Thus, even in the method of making an electroformed product 100 according to Alternative Example 2, in which the metal coating 50 also remains on the side surfaces 40a of the electroformed portion 40 of the first layer, there is no gap at the boundary 65 (see FIG. 1T) between the two Surface of the electroformed portion 40 of the first layer and the resist 60 of the second layer, so that the dimensional accuracy of the manufactured electroformed product 100 can be improved.
    Thereby, the same effects and effects as in the method of manufacturing an electroformed product 100 in which the electroformed portion 80 of the second layer is made smaller than the electroformed portion 40 of the first layer, and the wear resistance, corrosion resistance and decorative effect can be obtained of the side surfaces 40a of the electroformed portion 40 of the first layer can be improved.
    <Alternative example 3>
    The electroformed product 100 according to the embodiment is integrally formed such that the electroformed portion 80 of the second layer is laid on the surface 41 of the electroformed portion 40 of the first layer. However, when the electroformed portion 80 of the second layer is partially inserted (anchor part) into and integrally formed with the electroformed portion 40 of the first layer, the shear strength at the boundary between the electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer can be improved will.
    2A-2H are schematic sectional views showing the flow of the method for manufacturing a two-layer electroformed product 100 according to an alternative example (3) of the embodiment in Figs. 1A-1L. In the production method shown in accordance with alternative example 3, first, as shown in FIG. 2A, the resist 20 of the first layer is applied to the electrically conductive substrate 10, whereupon, as in the embodiment described above, exposed areas 21 and unexposed areas 22 on the resist 20 by the radiation of the UV Light L can be formed using the photomask 30, after which the unexposed areas 22 are removed to form electroformed portions 40.
    The exposed area 21 between the two unexposed areas 22 (corresponding to the electroformed sections 40 in the figure) corresponds to a cavity in which an anchor part 81 is later formed, which is formed on the electroformed section 80 of the second layer.
    By plating after development, the electroformed portions 40 of the first layer are formed in the locations corresponding to the two unexposed areas 22.
    If all exposed areas 21 of the resist 20 of the first layer are then removed, as shown in FIG. 2B, a cavity 24 is formed between the two electroformed sections 40. Thereafter, a metal coating 50 is formed on the surfaces 41 of the electroformed portions 40 by dry or wet plating the entire area including the surfaces 41 of the two electroformed portions 40, as shown in FIG. 2C. The formation of the metal coating 50 occurs after an oxide layer on the surface of the electroformed portions 40 has been previously removed.
    After forming the metal coating 50 on the surfaces 41 of the electroformed portions 40, as shown in Figure 2D, the resist 60 of the second layer is formed on the substrate 10 so as to cover the area up to the top of the electroformed portions 40 of the first layer.
    Next, as shown in Fig. 2E, the UV light L is irradiated onto the resist 60 through a photo mask 90 provided with openings 91 and a shield 92. As a result, areas (exposed areas) 61 which were irradiated with the UV light L through the openings 91 and an area (unexposed area) 62 which was not irradiated with the UV light L due to the shield 92 are formed on the resist 60. The unexposed area 62 is at least partially formed in such a way that it spans the two electroformed sections 40 of the first layer, i.e. enclosing the cavity 24.
    Next, as shown in Fig. 2F, the unexposed area 62 of the resist 60 is removed by developing. A corresponding cavity 63 is formed at the point where the unexposed area 62 was present. This cavity 63 comprises the cavity 24 between the two electroformed sections 40 of the first layer.
    Here, the surface 41 of the electroformed portions 40 of the first layer is covered by the metal coating 50. Also in the area facing the cavity 63, it is not the electroformed sections 40, but rather the metal coating 50 that covers the electroformed sections 40 in the cavity 63 that are exposed. A portion of the exposed areas 61 of the resist 60 that was not removed remain on the metal coating 50.
    Next, as shown in Fig. 2G, by electroplating using the substrate 10 as a cathode, the electroformed portion 80 of the second layer of nickel is formed, with which the cavity 63 is filled, with the exposed areas 61, the electroformed portions 40 of the first layer and the substrate 10 serve as a mold. Here part of the electroformed section 80 of the second layer is designed as an anchor part 81 which is inserted into the cavity 24 between the two electroformed sections 40 of the first layer.
    The electroforming material is not limited to nickel, but any electroformable material such as copper, tin or cobalt can be used.
    Next, as needed, the surface of the electroformed portion 80 of the second layer and the surface of the resist 60 of the second layer (exposed areas 61) are ground and polished to make them flat, whereupon the resist 60 of the second layer (exposed areas 61 ) is removed, thereby forming the electroformed product 100 in which the electroformed portions 40 of the first layer and the electroformed portion 80 of the second layer different in shape from the first layer are integrally formed.
    Thereafter, if necessary, the metal coating 50 formed on the boundary 65 of the electroformed product 100 (see Fig. 2F) is removed by etching. By finally separating the electroformed product 100 from the substrate 10, an electroformed product 100 can be completed in which, as shown in Fig. 2H, the shapes of the two layers are integrally formed.
    In this way, the electroformed product 100 manufactured by the manufacturing method according to Alternative Example 3 can achieve not only the same effects as the electroformed product 100 according to the embodiment but also the shear strength at the boundary between each electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer at which the step is created, since part of the electroformed section 80 of the second layer is inserted as an anchor part 81 into the cavity 24 between the electroformed sections 40 of the first layer and is formed in one piece therewith.
    <Alternative example 4>
    In the method of making an electroformed product 100 according to Alternative Example 3, after the electroformed portions 40 of the first layer (see FIG. 2A) are formed, the resist 20 of the first layer (exposed areas 21) is applied prior to the formation of the metal coating 50 (see FIG. 2C) removed. However, the method for manufacturing an electroformed product according to the present invention is not limited to this shape.
    3A-3H are schematic cross-sectional views showing the flow of the method for making a two-layer electroformed product 100 according to an alternate example 4. Figs.
    The method of making an electroformed product 100 according to Alternative Example 4 is another alternative example to the embodiment shown in Figures 1A-1L and is the same as Alternative Example 3 except for variations in some of the processes. In the manufacturing method of Alternative Example 4, after the electroformed portions 40 of the first layer (see Fig. 3A) are formed, the metal coating 50 is formed on the surfaces 41 of the electroformed portions 40 of the first layer as shown in Fig. 3B, followed by as shown in Fig. 3C , the resist 20 of the first layer (exposed areas 21) is removed.
    Here, as shown in Fig. 3B, the metal coating 50 is formed on the surfaces 41 of the electroformed portions 40 of the first layer by dry plating using a stencil mask 110 having openings 111 corresponding to the surfaces 41 of the electroformed portions 40. Although the metal coating 50 may be formed by wet plating, it should be noted that removing an oxide film on the surfaces of the electroformed portions 40 may leave the removal solution that has penetrated the gap on the resist 21 and cause corrosion.
    As a result, the metal coating 50 is formed only on the surfaces 41 of the electroformed portions 40, and not on the surface of the resist 20 corresponding to the shielded part except for the openings 111. This allows the metal coating 50 to be formed in a smaller volume than in Alternative Example 3, so that the volume of the expensive noble metal used to form the metal coating 50 can be reduced.
    After forming the metal coating 50 on the surfaces 41 of the electroformed portions 40 (Fig. 3B), as shown in Fig. 3C, all exposed areas 21 of the resist 20 of the first layer are removed, whereupon the resist 60 of the second layer is formed on the substrate 10 in this way becomes that it covers the area up to the top of the electroformed portions 40 of the first layer (Fig. 3D).
    Next, as shown in Fig. 3E, the UV light L is irradiated onto the resist 60 through the photo mask 90 provided with openings 91 and a shield 92. As a result, areas (exposed areas) 61 which were irradiated with the UV light L through the openings 91 and an area (unexposed area) 62 which was not irradiated with the UV light L due to the shield 92 are formed on the resist 60. The unexposed area 62 is at least partially formed in such a way that it spans the two electroformed sections 40 of the first layer, i.e. enclosing the cavity 24 between the electroformed sections 40 of the first layer.
    Next, as shown in Fig. 3F, the unexposed area 62 of the resist 60 is removed by developing. A corresponding cavity 63 is formed at the point where the unexposed area 62 was present. This cavity 63 comprises the cavity 24 between the two electroformed sections 40 of the first layer.
    Here, the surfaces 41 of the electroformed portions 40 of the first layer are covered by the metal coating 50. In the area facing the cavity 63, with the exception of the surfaces 41, the electroformed portions 40 in the cavity 63 are exposed.
    It is therefore necessary to remove the oxide layer on the side surfaces of the electroformed portions 40 on the side facing the cavity 63 before the next electroplating. The metal coating 50 is present at the boundary 65 between the resist 60 (exposed areas 61) and the electroformed sections 40, so that no air gap arises at the boundary 65. A portion of the exposed areas 61 of the resist 60 that was not removed remain on the metal coating 50.
    Next, as shown in Fig. 3G, by electroplating using the substrate 10 as a cathode, the electroformed portion 80 of the second layer of nickel, with which the cavity 63 is filled, with the exposed areas 61, the electroformed portions 40 of the first layer and the substrate 10 serve as a mold. Here part of the electroformed section 80 of the second layer is designed as an anchor part 81 which is inserted into the cavity 24 between the two electroformed sections 40 of the first layer.
    The electroforming material is not limited to nickel, but any electroformable material such as copper, tin or cobalt can be used.
    Next, as necessary, the surface of the electroformed portion 80 of the second layer and the surface of the resist 60 of the second layer (exposed areas 61) are ground and polished to make them flat, whereupon the resist 60 of the second layer (exposed areas 61 ) is removed, thereby forming an electroformed product 100 in which the electroformed portions 40 of the first layer and the electroformed portion 80 of the second layer, which is different in shape from the first layer, are integrally formed.
    Thereafter, the metal coating 50 formed on the boundary 65 of the electroformed product 100 (see Fig. 3F) is removed by etching. By finally separating the electroformed product 100 from the substrate 10, an electroformed product 100 can be completed in which, as shown in Fig. 3H, the shapes of the two layers are integrally formed.
    In this way, the electroformed product 100 manufactured by the manufacturing method according to Alternative Example 4 can achieve not only the same effects as the electroformed product 100 according to the embodiment but also the shear strength at the boundary between each electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer, since part of the electroformed section 80 of the second layer is introduced as an anchor part 81 into the cavity 24 between the electroformed sections 40 of the first layer and is formed in one piece therewith.
    In addition, the volume of the metal coating 50 used can be reduced compared to the manufacturing method according to Alternative Example 3, so that the manufacturing cost can be reduced.
    Furthermore, there is no metal coating 50 at the boundary (peripheral surface) between the anchor part 81 of the electroformed portion 80 of the second layer and the electroformed portions 40 of the first layer, and direct contact with the same kind of metal (e.g. nickel) is possible. Therefore, as compared with a structure with the metal plating 50 interposed therebetween, the affinity is improved and the adhesiveness is increased, so that the strength of union between the electroformed portions 40 of the first layer and the electroformed portion 80 of the second layer can be further improved.
    <Alternative example 5>
    In the electroformed product 100 according to Alternative Examples 3 and 4, since the anchor part 81 of the electroformed portion 80 of the second layer is inserted between the electroformed portions 40 of the first layer, the shear strength at the boundary between each electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer be improved. If the electroformed portions 40 of the first layer have constrictions and the front end of the anchor member 81 is made larger than the constriction, the tensile strength in the stacking direction of the electroformed portions 40 of the first layer and the electroformed portion 80 of the second layer can be further improved compared to the electroformed product 100 according to FIG alternative examples 3 and 4.
    In the method for producing an electroformed product 100 according to alternative example 5, a narrowing 24b is therefore formed on a side of the cavity 24 closer to the electroformed section 80 of the second layer between the electroformed sections 40 of the first layer of the electroformed product 100 according to alternative examples 3 and 4, which is narrower is as a front end 24a on a side remote from the electroformed portion 80 of the second layer to make a front end 81a of the anchor part 81 of the electroformed portion 80 of the second layer thicker than a base end 81b.
    4A-4G are schematic cross-sectional views showing the flow of the method for making a two-layer electroformed product 100 according to an alternate example 5. Figs.
    In the method for producing an electroformed product 100 according to the alternative example 5, as shown in FIG. Made of copper and corresponds to the front end 81a of the anchor part 81 of the electroformed portion 80 of the second layer. The cavity-forming component 120 later forms the front end 24a of the cavity 24. The cavity-forming component 120 must consist of a different element than the electroformed portions 40 since it must later be selectively removed.
    Subsequently, the resist 20 is applied in such a way that it covers the cavity-forming component 120 and, as shown in Fig. 4B, is irradiated with the UV light L via the photomask 30, the openings 31 and shields 32 being formed on the photomask 30 in such a way that that a part of the resist 20 that corresponds to a central area of the cavity-forming component 120 (ie a part that is narrower than the cavity-forming component and on which the constriction 24b will later be formed) serves as the exposed area 21, and parts that are both sides and the outside of the cavity-forming component 120, serve as unexposed areas 22.
    Next, as shown in Fig. 4C, the unexposed area 22 of the resist 20 is removed by developing to form the parts of the cavity 23 corresponding to both sides and the vicinity of the cavity-forming member 120.
    Next, as shown in Fig. 4D, e.g. The electroformed portions 40 of the first layer of nickel with which the cavity 23 is filled, the remaining exposed areas 21 of the resist 20 and the substrate 10 serving as a mold, are formed, for example, by galvanic nickel plating. Since the cavity-forming component 120 and the exposed area 21 of the resist 20 remain on the cavity-forming component 120 on the substrate 10, the electroformed portions 40 of the first layer are formed without a central part.
    Next, as needed, the surfaces of the electroformed portions 40 of the first layer and the surface of the resist 20 of the first layer (exposed areas 21) are ground and polished to make them flat.
    Next, the metal coating 50 is formed on the surfaces 41 of the electroformed portions 40 of the first layer by dry or wet plating using the stencil mask 110 having the openings 111 corresponding to the surfaces 41 of the electroformed portions 40 of the first layer, followed by, as in FIG 4D, the exposed areas 21 of the resist 20 are removed.
    Next, as shown in Fig. 4E, the cavity forming member 120 is removed by etching. If z. For example, if the cavity-forming component 120 consists of copper, the cavity-forming component 120 is selectively removed with an etching solution based on ammonium peroxonate.
    Thereby, on the side of the electroformed portions 40 of the first layer closer to the stacked electroformed portion 80 of the second layer, the cavity 24 is formed with the constriction 24b narrower than the front end 24a on the side remote from the electroformed portion 80 of the second layer.
    Next, the resist 60 of the second layer is formed on the substrate 10 so as to cover the electroformed portions 40 of the first layer.
    Next, as shown in Fig. 4F, the UV light L is irradiated onto the resist 60 through the photo mask 90 provided with the openings 91 and the shield 92. As a result, the areas (exposed areas) 61 which were irradiated with the UV light L through the openings 91 and the area (unexposed area) 62 which were not irradiated with the UV light L due to the shield 92 are formed on the resist 60. The unexposed area 62 is at least partially formed in such a way that it spans the two electroformed sections 40 of the first layer, i.e. enclosing the constriction 24b of the cavity 24.
    Next, as shown in Fig. 4G, the unexposed area 62 of the resist 60 is removed by developing, and the cavity 24 corresponding to the area where the unexposed area 62 was formed is formed. For example, the electroformed portion 80 of the second layer of nickel is formed by electroplating with nickel which is filled in the cavity 24, the exposed areas 61, the electroformed portions 40 of the first layer and the substrate 10 serving as the mold.
    Here, part of the electroformed portion 80 of the second layer is formed as an anchor part 81 which is inserted into the cavity 24 between the two electroformed portions 40 of the first layer. The front end 81a of this anchor part 81, which was formed corresponding to the front end 24a of the cavity 24, is made thicker than the base end 81b, which was formed corresponding to the constriction 24b of the cavity 24. That is, the front end 81a of the anchor part 81 is made thicker than the constriction 24b of the cavity 24.
    Next, the resist 60 of the second layer (exposed areas 61) is removed to form the electroformed product 100 in which the electroformed portions 40 of the first layer and the electroformed portion 80 of the second layer are different in shape from the first layer differs, are formed in one piece.
    By separating the electroformed product 100 from the substrate 10, an electroformed product 100 in which the shapes of the two layers are integrally formed as shown in Fig. 4G can be completed.
    In this way, the electroformed product 100 manufactured by the manufacturing method according to Alternative Example 5 can achieve not only the same effects as the electroformed product 100 according to the embodiment but also the shear strength at the boundary between each electroformed portion 40 of the first layer and the electroformed portion 80 of the second layer, since part of the electroformed section 80 of the second layer is inserted as an anchor part 81 between the electroformed sections 40 of the first layer and is formed integrally therewith.
    Furthermore, the electroformed product 100 produced by the production method according to alternative example 5 can have a higher tensile strength than the electroformed product 100 according to alternative examples 3 and 4 because the electroformed portions 40 of the first layer have the constriction 24b and the front end 81a of the anchor part 81 of the electroformed portion 80 of the second layer is formed thicker than the throat 24b to secure the electroformed portions 40 of the first layer and the electroformed portion 80 of the second layer when they are pulled in the stacking direction.
    Although the front end 81a and the base end 81b of the anchor member 81 according to Alternative Example 5 are connected to each other by the portion extending in the stacking direction of the electroformed portions 40 of the first layer and the electroformed portion 80 of the second layer, instead of the portion extending in the stacking direction may also be connected to each other by a tapered portion widening from the base end 81b toward the front end 81a.
    Although the electroformed product 100 according to the embodiment described above and the respective alternative examples are e.g. For example, if a safety pin is pressed and fixed into an armature of a mechanical watch (with the electroformed portion corresponding to the first layer of a rod and the electroformed portion 80 corresponding to the second layer of a shaft that is pressed into the armature), the method is for manufacturing an electroformed product 100 and the electroformed product 100 according to the embodiment and the respective alternative examples are not limited to the above-described safety pin, but are applicable to various components (such as gears) used for timepieces and are besides timepieces also applicable to various other articles.
    It is particularly advantageous that the method for manufacturing an electroformed product and the electroformed product according to the present invention are applied to integral parts in which the first and second layers have different contour shapes.
    The present invention can be applied to a one-piece electroformed product having two or more layers having different contour shapes, and is not limited to an electroformed product composed of only two layers.
    [List of reference symbols]
    40 electroformed portion of the first layer 41 surface 50 metal coating 60 resist 62 unexposed area 80 electroformed portion of the second layer 100 electroformed product L UV light
    权利要求:
    Claims (10)
    [1]
    A method of manufacturing an electroformed product (100), wherein electroformed portions (40, 80) formed by metal plating are stacked in the thickness direction, thereby integrally forming the multilayer electroformed portions (40, 80), comprising the following steps :Forming a metal coating (50) which has good corrosion resistance and is difficult to form an oxide layer on a surface (41) of the previously formed electroformed portion (40) on which the next electroformed portion (80) is coated;Forming a resist (60) for the next electroformed portion (80) on the metal coating (50);Removing a portion (62) of the resist (60) corresponding to the next electroformed portion (80) by exposure and development; andForming the next electroformed portion (80) where the resist (60) was removed.
    [2]
    A method of making an electroformed product according to claim 1, wherein prior to forming the next electroformed portion (80) at least partially another portion of the resist (60) that has not been removed to form the next electroformed portion (80) remains on the metal coating (50).
    [3]
    The method of making an electroformed product (100) according to claim 1 or 2, wherein the metal coating (50) is a noble metal or an alloy of noble metals.
    [4]
    A method of manufacturing an electroformed product (100) according to any one of claims 1 to 3, wherein an oxide layer is removed from the surface (41) of the previously formed electroformed portion (40) prior to forming the metal coating (50).
    [5]
    5. A method for producing an electroformed product (100) according to any one of claims 1 to 4, comprising the following steps:Forming a cavity (24) in the layer corresponding to the previously formed electroformed portion (40); andForming an anchor member (81) on the nearest electroformed portion (80), the anchor member (81) being inserted into the cavity (24).
    [6]
    6. A method of making an electroformed product (100) according to claim 5, comprising the steps of:Forming a constriction (24b) at a location on a side of the cavity (24) closest to the electroformed portion (80), the constriction (24b) being narrower than a location on a side remote from the next electroformed portion (80); andForming a portion of the anchor member (81) which is inserted into the location of the cavity (24) on the side remote from the next electroformed portion (80), the portion of the anchor member (81) being made thicker than the constriction (24b).
    [7]
    A method of manufacturing an electroformed product (100) according to any one of claims 1 to 6, comprising the following steps:Forming a screen-forming layer (11) of an electrically conductive material other than the metal coating (50) on the substrate (10);Forming the previously formed electroformed portion (40) on the screen-forming layer (11);Removing the screen-forming layer (11) to a position where the screen-forming layer (11) is retracted from the side surfaces (40a) of the previously formed electroformed portion (40) to the inside;Forming the metal coating (50) on the substrate (10) and the previously formed electroformed portion (40);Forming a gap (12) between the metal coating (50) formed on the substrate (10) and the metal coating (50) formed on the side surfaces (40a) of the previously formed electroformed portion (40) as a result of Removing the screen-forming layer (11) to the retracted position; andRemoving the screen-forming layer (11) remaining between the previously formed electroformed portion (40) and the substrate (10) by etching across the gap (12) after forming the next electroformed portion (80) over the metal coating (50) on the previous one formed electroformed portion (40).
    [8]
    A method of making an electroformed product (100) according to claim 7, comprising the steps of:Forming the metal coating (50) on the screen-forming layer (11) prior to forming the previously formed electroformed portion (40) on the screen-forming layer (11); andForming the previously formed electroformed portion (40) on the metal coating (50).
    [9]
    9. An electroformed product (100) in which a plurality of electroformed portions (40, 80) formed by metal plating are stacked in the thickness direction,wherein a metal coating (50) having no oxide film and good corrosion resistance is formed at a boundary between the electroformed portions (40, 80) stacked at which a step is created.
    [10]
    10. The electroformed product (100) of claim 9, wherein the metal coating (50) is a noble metal or an alloy of noble metals.
    类似技术:
    公开号 | 公开日 | 专利标题
    DE2319883C3|1982-11-18|Method for producing conductor patterns on a semiconductor device
    DE1965546C3|1980-05-22|Semiconductor component
    DE1817434C3|1980-05-14|Method for producing an electrical line arrangement
    EP0658300B1|2000-09-27|Structured printed circuit boards and films and process for producing them
    DE4424962A1|1995-01-19|Method for producing a chip contact
    DE2353615A1|1974-05-09|PROCESS AND DEVICE FOR PRODUCING ELECTRICAL INTERMEDIATE CONNECTIONS
    WO2009021713A1|2009-02-19|Method for producing a semiconductor component, a semiconductor component, and an intermediate product in the production thereof
    DE60124704T2|2007-03-15|PROCEDURE FOR PATTERN EDUCATION
    DE112015006047T5|2017-11-23|MANUFACTURING PROCESS FOR A SPATIAL PCB, ROOMED PCB AND SUBSTRATE FOR A SPATIAL PCB
    DE2315710C3|1975-11-13|Method for manufacturing a semiconductor device
    DE1765164A1|1971-07-01|Method of binding electrical conductors
    EP0308816A1|1989-03-29|Process for the production of connection contacts for thin film magnetic heads
    DE1764671A1|1971-10-07|Integrated magnetic circuit
    CH717177A2|2021-08-31|Method of manufacturing an electroformed product and electroformed product.
    DE2658532A1|1978-06-29|INTERMEDIATE SUPPORT FOR HOLDING AND CONTACTING A SEMICONDUCTOR BODY
    DE3730953C2|1989-07-27|
    DE1764611A1|1971-09-09|Process for the production of magnetic elements
    DE10156054C2|2003-11-13|Manufacturing process for a conductor track on a substrate
    DE102004005645B4|2006-01-12|Process for the production of layer structures for signal distribution
    DE102004005022B4|2006-02-16|Process for the production of metal interconnects on electronic components
    AT315947B|1974-06-25|Method for producing a leadframe for integrated circuits
    DE112017007319T5|2020-01-02|Semiconductor device, power conversion device, and method of manufacturing a semiconductor device
    DE4026822C2|1999-08-19|Method for producing a carrier for surface-mountable electronic components, in particular a TAB film carrier
    DE2135488A1|1973-04-19|Plating baths - for universal carriers for integrated circuits
    DE2613759B2|1980-04-24|Method for producing a multilayer metal connection contact for a semiconductor component
    同族专利:
    公开号 | 公开日
    CN113322494A|2021-08-31|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    JP2020033185|2020-02-28|
    JP2020195664A|JP2021139038A|2020-02-28|2020-11-26|Method for producing electrocast product, and electrocast product|
    [返回顶部]